It issuitable for processing hard board and covering film on brittlematerials such as silicon wafer, ceramic substrate and quartzglass wafer.
Pressure and speed can be adjusted according todifferent materials.
Technical Data:
.Max. Film width: 400mm
.Board thickness: 0.2 - 3mm
.Film speed: 0.2-1.2mm/min
.Temperature: 20-200 ?
.Pressure adjustment: Double motor electric control
.Power Supply: 220VAC/50Hz
.Rated Power: 700W
.Weight: 35kg
.Dimension
.equipped with infrared temperature sensor,intelligent temperature controller real-timedetection, display, and accurate control of the roller surfacetemperature through PID algorithm
.laminating mode: double-sided simultaneous laminatingcan realize synchronous stripping of PE film
.the load-carrying roller meets industry standards and canbe fitted with standard dry film up to 500 feet long