Measurement principle

3D white light PSLM PMP

(programmable spatial light modulation, phase measurement profilometry)

Measurements

Volume, acreage, height, XY offset, shape

Detection of non-performing types

Missing print, insufficient tin, excessive tin, bridging, offset mal-shapes, surface contamination

Lens resolution

4.5 µm /5 µm /6 µm /8 µm /10 µm /12 µm /15 µm /16 µm /18 µm /20 µm

(optional for different camera models)

Accuracy

XY (Resolution): 10 µm

Repeatability

Height: = 1 µm (4 sigma); volume/area: < 1% (4 sigma)

Inspection speed

0.35 sec/FOV - 0.5 /FOV, according to the actual configuration

Quality of inspection head

Standard 1, option 2, 3

Mark point detection time

0.3 sec/piece

Max. measuring head

± 550 µm (± 1,200 µm as option)

Max. measuring height pf PCB warp

± 5 mm

Min. pad spacing

100 µm (pad height is 150 µm pad as reference) 80 µm /100 µm /150 µm /200 µm (determined according to actual configuration)

Min. element

01005/03015/008004 (option)

Max. loading PCB size (X x Y)

470 x 500 mm

Conveyor setup

Front orbit (back orbit as option)

engineering statistics

Histogram; Xbar-R chart; CP&CPK; % gage repartability data; spi daily/weekly/ monthly reports

Gerber & CAD Data import

Support gerber format (274x, 274d), manual teach model; CAD X/Y, Part No., Pac-kage Type imput

Operating system support

Windows 10®

Equipment dimension (W x D x H)

1,000 x 1,174 x 1,550 mm

Weight

985 Kg