Online laser cutting equipment is suitable for carrier-orbit transport cutting, easy integration into production lines, and is suitable for precision and rapid full cutting of various materials, including PCB outlines (including pre-assembled circuit boards), PCB breakpoint cutting; FPC outline cutting, cover film cutting, rigid-flex circuit board delidding and outline cutting. It can also be used for LTCC/HTCC ceramic punching; direct processing of conductive patterns; removal of corrosion-resistant layers, removal of process leads and soldermask layer windowing; mature ceramic punching; and FPC micro-via processing.
Several versions available :
|
Version |
SA4-UV20SP-N |
SA4-GR40SP-N |
|
Type |
UV Laser Nanoseconde |
Green Laser Nanoseconde |
|
Wavelength |
355nm |
532nm |
|
POWER |
20W |
40W |
|
Laser source Brand |
Spectra Physics |
Spectra Physics |
Other laser sources on request (Picosecond, ADVANCED OPTOWAVE brand…)
System consisting of:
.Laser source (Specifications according to the version)
.Granite X/Y table
.Visionsystem with high resolution camera
.Camera supported positioning system with fiducial recognition
.X/Y axises driven by Linear motor
.Industrial control PC and display
.Data processing software: CircuitCAM7 Laser
.Machine operating software: DreamCreaTor 3
.Exhaust unit HPremi220
Technical data for laser system:
|
Scanner resolution: |
1µm |
|
Accuracy of repeatability |
±3 µm |
|
Z axis travel: |
40mm |
|
Loading and unloading method |
Track in/out |
|
Transfer direction: |
From left to right |
|
Platform height: |
920±30mm |
|
Loading and unloading conveyor speed: |
0-200mm/s |
|
Max. carrier size: |
350mm × 350mm |
|
Max. carrier weight: |
4KG |
|
Max. clamp plate thickness: |
5mm |
|
Machine weight: Approx. |
1500 kg |
|
Machine hood dimensions (W/H/D): |
1750mm x 940mm x 1650mm |
|
Power supply: |
220VAC/50Hz / 2.5kW |
Technical data for exhaust unit :
|
Air flow rate: |
220 m³/h |
|
Pressure: |
27000 Pa |
|
Rated power: |
1.3 kW |
|
Noise level : |
approx. 62 dB |
Specific References